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 TFBS4710
Vishay Semiconductors
Serial Infrared Transceiver SIR, 115.2 kbit/s, 2.7 V to 5.5 V Operation
Description
The TFBS4710 is a low profile, full range Infrared Data Transceiver module. It supports IrDA data rates up to 115.2 kbit/s (SIR). The transceiver module consists of a photo PIN photodiode, an infrared emitter (IRED), and a low-power CMOS control IC to provide a total front-end solution in a single package. The device has a link distance of 1 meter. The RXD pulse width is independent of the duration of TXD pulse and always stays at a fixed width thus making
18071
the device optimum for all standard SIR Encoder/ Decoder and interfaces. The Shut Down (SD) feature cuts current consumption to typically 10 nA.
Features
* Compliant with the latest IrDA physical layer specification (9.6 kbit/s to 115.2 kbit/s) e4 * Small package: H 2.74 mm x D 3.33 mm x L 8.96 mm * Typical Link distance 1 m * Drop in replacement for IRM5000D/ IRMT5000 * Battery & Power Management Features: > Idle Current - 75 A Typical > Shutdown Current - 10 nA Typical > Operates from 2.4 V - 5.0 V within specification over full temperature range from - 25 C to + 85 C * Remote Control - transmit distance up to 8 meters * Tri-State Receiver Output, floating in shutdown with a weak pull-up * Fixed RXD output pulse width (2 s typical) * Meets IrFM Fast Connection requirements * Split power supply, an independant, unregulated supply for IRED Anode and a well regulated supply for VCC
* Directly Interfaces with Various Super I/O and Controller Devices and Encoder/ Decoder such as TOIM4232. * Lead (Pb)-free device. * Device in accordance to RoHS 2002/95/EC and WEEE 202/96EC.
Applications
* * * * * * * * * * * * * * * Ideal for Battery Operated Devices PDAs Mobile Phones Electronic Wallet (IrFM) Notebook Computers Digital Still and Video Cameras Printers, Fax Machines, Photocopiers, Screen Projectors Data Loggers External Infrared Adapters (Dongles) Diagnostics Systems Medical and Industrial Data Collection Devices Kiosks, POS, Point and Pay Devices GPS Access Control Field Programming Devices
Parts Table
Part TFBS4710-TR1 TFBS4710-TT1 Description Oriented in carrier tape for side view surface mounting Oriented in carrier tape for top view surface mounting 1000 pcs 1000 pcs Qty / Reel
Document Number 82612 Rev. 1.5, 23-Feb-06
www.vishay.com 1
TFBS4710
Vishay Semiconductors Functional Block Diagram
Vcc1 Push-Pull Driver Amplifier Comparator
RXD Vcc2
SD TXD
Logic &
Control
Controlled Driver
RED C GND
18282
Pinout
TFBS4710 weight 100 mg
Definitions:
In the Vishay transceiver data sheets the following nomenclature is used for defining the IrDA operating modes: SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhy 1.0 MIR: 576 kbit/s to 1152 kbit/s FIR: 4 Mbit/s VFIR: 16 Mbit/s MIR and FIR were implemented with IrPhy 1.1, followed by IrPhy 1.2, adding the SIR Low Power Standard. IrPhy 1.3 extended the Low Power Option to MIR and FIR and VFIR was added with IrPhy 1.4. A new version of the standard in any case obsoletes the former version. With introducing the updated versions the old versions are obsolete. Therefore the only valid IrDA standard is the actual version IrPhy 1.4 (in Oct. 2002).
1
18511
2
3
4
5
6
Pin Description
Pin Number 1 Function IRED Anode TXD Description IRED Anode is connected to a power supply. The LED current can be decreased by adding a resistor in series between the power supply and IRED Anode. A separate unregulated power supply can be used at this pin. This Input is used to turn on IRED transmitter when SD is low. An on-chip protection circuit disables the LED driver if the TXD pin is asserted for longer than 80 s Received Data Output, normally stays high but goes low for a fixed duration during received pulses. It is capable of driving a standard CMOS or TTL load. Shutdown. Setting this pin active for more than 1.5 ms switches the device into shutdown mode Regulated Supply Voltage Ground Document Number 82612 Rev. 1.5, 23-Feb-06 I HIGH I/O Active
2
3 4 5 6 www.vishay.com 2
RXD SD VCC GND
O I
LOW HIGH
TFBS4710
Vishay Semiconductors Absolute Maximum Ratings
Reference Point Ground, Pin 6 unless otherwise noted. Parameter Supply voltage range, all states Input current Output Sink Current, RXD Average output current, pin 1 IRED anode voltage, pin 1 Voltage at all inputs and outputs Vin > VCC is allowed Power dissipation Junction temperature Ambient temperature range (operating) Storage temperature range Soldering temperature See Recommended Solder Profile Tamb Tstg - 30 - 40 See derating curve 20 % duty cycle IIRED (DC) IIRED (RP) VIREDA VIN - 0.5 - 0.5 Repetitive pulsed output current < 90 s, ton < 20 % For all Pins except IRED Anode Pin Test Conditions Symbol VCC ICC Min - 0.3 Typ. Max + 6.0 10.0 25.0 60 300 + 6.0 + 6.0 200 125 + 85 + 100 260 Unit V mA mA mA mA V V mW C C C C
Electrical Characteristics Transceiver
Tamb = 25 C, VCC = VIREDA = 2.4 V to 5.5 V unless otherwise noted. Parameter Supply voltage range, all states Idle supply current at VCC1 (receive mode, no signal) SD = Low, Ee = 1 klx , Tamb = - 25 C to + 85 C, VCC1 = VCC2 = 2.7 V to 5.5 V SD = Low, Ee = 1 klx*), Tamb = 25 C, VCC1 = VCC2 = 2.7 V to 5.5 V Receive current Shutdown current Operating temperature range Output voltage low, RXD Output voltage high, RXD RXD to VCC impedance Input voltage low: TXD, SD Input voltage high: TXD, SD CMOS level (0.5 x VCC typ, threshold level) SD, TXD = "0" or "1", 0 < Vin < 0.15 VCC SD, TXD = "0" or "1" Vin > 0.7 VCC Input capacitance IOL = 1 mA IOH = - 500 A IOH = - 250 A VCC = 2.7 V SD = High, T = 25 C, Ee = 0 klx SD = High, T = 85 C
*)
Test Conditions
Symbol VCC ICC1
Min 2.4
Typ. 90
Max 5.5 130
Unit V A
ICC1
75
A
ICC ISD ISD TA VOL VOH VOH RRXD VIL VIH IICH IIRTx IIRTx CIN -1 - 25 - 0.5 0.8 x VCC 0.9 x VCC 400 - 0.5 VCC - 0.5 -2
280 2 3 + 85 0.15 x VCC VCC + 0.5 VCC + 0.5 500 600 0.5 6.0 +2 + 150 0 1 5
A A A C V V V k V V A A A pF
Input leakage current (TXD, SD) Vin = 0.9 x VCC Controlled pull down current
Document Number 82612 Rev. 1.5, 23-Feb-06
www.vishay.com 3
TFBS4710
Vishay Semiconductors Optoelectronic Characteristics Receiver
Tamb = 25 C, VCC = 2.4 V to 5.5 V unless otherwise noted Parameter Minimum detection threshold irradiance, SIR mode Maximum detection threshold irradiance Maximum no detection threshold irradiance Rise time of output signal Fall time of output signal RXD pulse width Leading edge jitter Standby /Shutdown delay Receiver startup time Latency 10 % to 90 %, CL = 15 pF 90 % to 10 %, CL = 15 pF Input pulse width > 1.2 s Input Irradiance = 100 mW/m2, 115.2 kbit/s After shutdown active Power-on delay tL 150 s Test Conditions 9.6 kbit/s to 115.2 kbit/s = 850 nm - 900 nm, = 0, 15 = 850 nm - 900 nm Symbol Ee Min 10 (1.0) Typ. 25 (2.5) 5 (500) 4 (0.4) 10 10 1.65 2.0 100 100 3.0 250 150 Max 40 (4) Unit mW/m2 (W/cm2) kW/m2 (mW/cm2) mW/m2 (W/cm2) ns ns s ns s
Ee Ee tr(RXD) tf(RXD) tPW
Transmitter
Tamb = 25 C, VCC = 2.4 V to 5.5 V unless otherwise noted. Parameter IRED operating current IRED forward voltage IRED leakage current Output radiant intensity Ir = 300 mA TXD = 0 V, 0 < VCC < 5.5 V = 0, 15, TXD = High, SD = Low VCC = 5.0 V, = 0, 15, TXD = High or SD = High (Receiver is inactive as long as SD = High) Output radiant intensity, angle of half intensity Peak-emission wavelength Spectral bandwidth Optical rise time Optical fall time Optical output pulse duration Input pulse width 1.63 s, 115.2 kbit/s Input pulse width tTXD < 20 s Input pulse width tTXD 20 s Optical overshoot Test Conditions Symbol ID Vf IIRED Ie Ie Min 250 1.4 -1 40 70 Typ. 300 1.8 Max 350 1.9 1 350 0.04 Unit mA V A mW/sr mW/sr
p tropt tfopt topt topt topt 10 10 1.46 tTXD 880
24 900 45 100 100 1.63 1.8 t + 0.15 50 25
nm nm ns ns s s s %
www.vishay.com 4
Document Number 82612 Rev. 1.5, 23-Feb-06
TFBS4710
Vishay Semiconductors Recommended Solder Profile
Solder Profile for Sn/Pb soldering
260 240 220 200 180
10 s max. at 230 C 240 C max.
2...4 C/s 160 C max.
Temperature/C
160 140 120 100 80 60 40 20 0 0 50 100 150 200 250 300 350
120 s...180 s
90 s max.
2...4 C/s
Time/s
19431
Figure 1. Recommende Solder Profile for Sn/Pb soldering.
Lead-Free, Recommended Solder Profile
The TFBS4710 is a lead-free transceiver and qualified for lead-free processing. For lead-free solder paste like Sn-(3.0 - 4.0)Ag-(0.5 - 0.9)Cu, there are two standard reflow profiles: Ramp-Soak-Spike (RSS) and Ramp-To-Spike (RTS). Shown below in figure 2 is Vishay's recommended profile for use with the TFBS4710 transceivers. For more details please refer to Application note: SMD Assembly Instruction.
280 260 240 220 200 180 Temperature/C 160 140 120 100 80 60 40 20 0 0
19261
T 255 C for 20 s max
T peak = 260 C max.
T 217 C for 50 s max
20 s
90 s...120 s
50 s max.
2 C...4 C/s
2 C...4 C/s
50
100
150 Time/s
200
250
300
350
Figure 2. Solder Profile, RSS Recommendation
Document Number 82612 Rev. 1.5, 23-Feb-06
www.vishay.com 5
TFBS4710
Vishay Semiconductors Recommended Circuit Diagram Table 1. High Operating Temperature > 70 C
Rled () VLED (V)
VCC IR Controller Vdd Rled TFBS4710 IREDA (1) IRTX IRRX IRMODE R1= 47 GND C4 C2 C3 C1 4.7 F 0.1F 4.7 F 0.1 F
18281
Rled () Low Power Mode (Intensity > 3.6 mW/sr, 0 - 15) 50 > 50 > 60
Standard Power Mode (Intensity > 40 mW/sr, 0 - 15) 3 6 18
2.7 3.3 5.0
TXD RXD SD Vcc GND
(2) (3) (4) (5) (6)
I/O and Software
In the description, already different I/Os are mentioned. Different combinations are tested and the function verified with the special drivers available from the I/O suppliers. In special cases refer to the I/ O manual, the Vishay application notes, or contact directly Vishay Sales, Marketing or Application.
Figure 3. Recommended Application Circuit
The TFBS4710 integrates a sensitive receiver and a built-in power driver. This combination needs a careful circuit layout. The use of thin, long, resistive and inductive wiring should be avoided. The inputs (TXD, SD) and the output (RXD) should be directly (DC) coupled to the I/O circuit. The combination of resistor R1 and capacitors C1, C2, C3 and C4 filter out any power supply noise to provide a smooth supply voltage. The placement of these components is critical. It is strongly recommended to position C3 and C4 as close as possible to the transceiver power supply pins. A Tantalum capacitor should be used for C1 and C3 while a ceramic capacitor should be used for C2 and C4. A current limiting resistor is not needed for normal operation. It is strongly recommended to use the Rled values mentioned in Table 1 below for high temperature operation. For Low Power Mode, IRED Anode voltage of less than 5 V is recommended. Under extreme EMI conditions as placing a RF transmitter antenna on top of the transceiver, it is recommended to protect all inputs by a low-pass filter, as a minimum a 12 pF capacitor, especially at the RXD port. Basic RF design rules for circuit design should be followed. Especially longer signal lines should not be used without proper termination. For reference see "The Art of Electronics" by Paul Horowitz, Winfield Hill, 1989, Cambridge University Press, ISBN: 0521370957.
Table 2. Recommended Application Circuit Components
Component C1, C3 C2, C4 R1 Rled Recommended Value 4.7 F, 16 V 0.1 F, Ceramic 47 , 0.125 W See Table 1 Vishay Part Number 293D 475X9 016B VJ 1206 Y 104 J XXMT CRCW-1206-47R0-F-RT1
www.vishay.com 6
Document Number 82612 Rev. 1.5, 23-Feb-06
TFBS4710
Vishay Semiconductors Table 3. Truth table
Inputs SD high > 1 ms low TXD x high high > s low Optical input Irradiance mW/m2 x x x <4 weakly pulled (500 ) to VCC1 high inactive high inactive high inactive Outputs RXD Transmitt er 0 Ie 0 0 Remark Operation Shutdown Transmitting Protection is active Ignoring low signals below the IrDA defined threshold for noise immunity Response to an IrDA compliant optical input signal Overload conditions can cause unexpected outputs
low low
> Min. Detection Threshold Irradiance < Max. Detection Threshold Irradiance > Max. Detection Threshold Irradiance
low (active) undefined
0 0
Document Number 82612 Rev. 1.5, 23-Feb-06
www.vishay.com 7
TFBS4710
Vishay Semiconductors Package Dimensions
18086
Drawing-No.: 6.550-5256.01-4 Issue: 1; 24.06.03 Figure 4. Package drawing TFBS4710
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Document Number 82612 Rev. 1.5, 23-Feb-06
TFBS4710
Vishay Semiconductors Reel Dimensions
14017
Tape Width mm 16
A max. mm 330
N mm 50
W1 min. mm 16.4
W2 max. mm 22.4
W3 min. mm 15.9
W3 max. mm 19.4
Document Number 82612 Rev. 1.5, 23-Feb-06
www.vishay.com 9
TFBS4710
Vishay Semiconductors Tape Dimensions
19611
Drawing-No.: 9.700-5299.01-4 Issue: 1; 18.08.05 Figure 5. Tape drawing for TFBS4710 for side view mounting
www.vishay.com 10
Document Number 82612 Rev. 1.5, 23-Feb-06
TFBS4710
Vishay Semiconductors Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Document Number 82612 Rev. 1.5, 23-Feb-06
www.vishay.com 11
Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale.
Document Number: 91000 Revision: 08-Apr-05
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